1. What is the projected Compound Annual Growth Rate (CAGR) of the Electronics Grade Pressure Sensitive Adhesives?
The projected CAGR is approximately 4.2%.
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Electronics Grade Pressure Sensitive Adhesives by Type (Hard Type, Soft Type), by Application (Personal Computers, LCD Monitors, Smartphones, Others), by North America (United States, Canada, Mexico), by South America (Brazil, Argentina, Rest of South America), by Europe (United Kingdom, Germany, France, Italy, Spain, Russia, Benelux, Nordics, Rest of Europe), by Middle East & Africa (Turkey, Israel, GCC, North Africa, South Africa, Rest of Middle East & Africa), by Asia Pacific (China, India, Japan, South Korea, ASEAN, Oceania, Rest of Asia Pacific) Forecast 2025-2033
The global Electronics Grade Pressure Sensitive Adhesives Market was valued at USD 2,455.1 million in 2022, and it is expected to grow at a CAGR of 4.2 % during the forecast period (2023-2033). The market growth is primarily driven by the increasing demand for electronics devices such as smartphones, laptops, and tablets. These devices require high-performance adhesives to bond various components together and protect them from environmental factors. Additionally, the growing trend of miniaturization in electronics is further fueling the demand for pressure sensitive adhesives (PSAs) with precise bonding capabilities.
The Electronics Grade Pressure Sensitive Adhesives market is segmented by type and application. Based on type, the market is divided into hard type and soft type. Hard type PSAs are used in applications where high strength and durability are required, such as bonding metal components in smartphones. Soft type PSAs, on the other hand, provide greater flexibility and conformability, making them ideal for bonding delicate components in electronic devices. In terms of application, the market is segmented into personal computers, LCD monitors, smartphones, and others. Smartphones currently account for the largest share of the market, driven by the high demand for these devices worldwide. The automotive sector is also expected to witness significant growth over the forecast period, as PSAs are used in various applications such as bonding interior trim components and sealing automotive sensors.
The flourishing electronics industry and the proliferating demand for advanced electronic devices have propelled the growth of the electronics grade pressure sensitive adhesives market. These adhesives are extensively employed in assembling electronic components, providing secure and durable bonding, and enhancing device performance. The growing adoption of smartphones, tablets, laptops, and other electronic gadgets has significantly contributed to the increasing demand for electronics grade pressure sensitive adhesives. Moreover, the rising popularity of wearable electronics, Internet of Things (IoT) devices, and automotive electronics is further driving market growth.
The preference for miniaturization and lightweight electronic devices has led to the development of advanced electronics grade pressure sensitive adhesives that offer superior adhesion, flexibility, and reliability. These adhesives enable manufacturers to create compact and efficient electronic assemblies, meeting the stringent requirements of modern electronics. Additionally, the increasing focus on sustainability has fueled the demand for environmentally friendly electronics grade pressure sensitive adhesives, which adhere to regulations and minimize environmental impact.
The electronics grade pressure sensitive adhesives market is primarily driven by the following factors:
Despite the positive market outlook, the electronics grade pressure sensitive adhesives industry faces certain challenges and restraints:
Region-wise Dominance:
Asia-Pacific is the dominant region in the electronics grade pressure sensitive adhesives market, primarily due to the presence of major electronics manufacturing hubs in countries such as China, Japan, and South Korea. The region is anticipated to maintain its dominance in the coming years, driven by the continued growth of the electronics industry.
Country-wise Dominance:
China is the largest market for electronics grade pressure sensitive adhesives, accounting for a significant share of the global market. The country's robust electronics manufacturing industry and the growing demand for consumer electronics have contributed to its leading position.
Segment-wise Dominance:
The hard type segment is expected to dominate the electronics grade pressure sensitive adhesives market owing to its high strength and durability, making it ideal for applications requiring secure bonding of electronic components.
The personal computers segment is anticipated to account for the largest share of the market, driven by the widespread use of computers in various industries and the increasing demand for high-performance adhesives in computer assembly.
Several factors are expected to contribute to the growth of the electronics grade pressure sensitive adhesives industry:
Some of the leading players in the electronics grade pressure sensitive adhesives market include:
The electronics grade pressure sensitive adhesives sector has witnessed several significant developments in recent years, including:
This report provides a comprehensive analysis of the electronics grade pressure sensitive adhesives market, including:
The report offers valuable insights for manufacturers, distributors, suppliers, and end-users in the electronics industry, enabling them to make informed decisions and capitalize on the growth opportunities in the electronics grade pressure sensitive adhesives market.
| Aspects | Details |
|---|---|
| Study Period | 2019-2033 |
| Base Year | 2024 |
| Estimated Year | 2025 |
| Forecast Period | 2025-2033 |
| Historical Period | 2019-2024 |
| Growth Rate | CAGR of 4.2% from 2019-2033 |
| Segmentation |
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Note*: In applicable scenarios
Primary Research
Secondary Research

Involves using different sources of information in order to increase the validity of a study
These sources are likely to be stakeholders in a program - participants, other researchers, program staff, other community members, and so on.
Then we put all data in single framework & apply various statistical tools to find out the dynamic on the market.
During the analysis stage, feedback from the stakeholder groups would be compared to determine areas of agreement as well as areas of divergence
The projected CAGR is approximately 4.2%.
Key companies in the market include Henkel, Dow Chemical, Ashland, Avery Dennison, H.B. Fuller, 3M, Mitsubishi Chemical Corporation, Arkema Group, Sika AG, tesa SE, Nitto Denko, Intertape Polymer, LINTEC Corporation, Soken Chemical & Engineering Co, NANPAO, .
The market segments include Type, Application.
The market size is estimated to be USD 2455.1 million as of 2022.
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The market size is provided in terms of value, measured in million and volume, measured in K.
Yes, the market keyword associated with the report is "Electronics Grade Pressure Sensitive Adhesives," which aids in identifying and referencing the specific market segment covered.
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